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LOS ANGELES, Calif., March 16, 2026 – Eoptolink Technology Inc., Ltd., a global leader and innovator in advanced optical interconnect solutions, today announced that it will unveil its new Optical Circuit Switch (OCS) products at OFC 2026.

As AI models scale to trillions of parameters, the underlying network infrastructure must evolve to support massive, predictable data flows across thousands of GPUs. In traditional electrical packet switch (EPS)-only networks, spine-layer switches can become a performance bottleneck. One deployment approach is to replace the spine-layer EPS with OCS, thereby increasing overall network throughput and enabling easy scaling of AI cluster sizes.

LOS ANGELES, Calif., March 13, 2026 – Eoptolink Technology Inc., Ltd., a global leader and innovator in advanced optical interconnect solutions, today announced the launch of its high-density 6.4T NPO optical module at OFC 2026. Designed to meet the demanding requirements of AI data centers, the new solution delivers exceptional performance, density, and efficiency for next-generation optical interconnects.

Eoptolink’s 6.4T NPO is a high-density near-packaged optical transceiver module designed to address performance and density challenges in AI data center interconnects. The module delivers 6.4 Tbps aggregate throughput across 32 lanes operating at 200 Gbps each, leveraging advanced Silicon Photonics (SiPh) technology.

LOS ANGELES, Calif., March 12, 2026 – Eoptolink Technology Inc., Ltd., a global leader and innovator in advanced optical interconnect solutions, today announced the demonstration of its next-generation IMDD 400G per-lambda based 1.6T DR4 OSFP transceiver at OFC 2026.

As AI applications expand across industries, the demand for AI infrastructure capable of supporting high-performance training and inference is driving a rapid evolution in AI cluster interconnects. This trend is reflected in the roadmap for high-speed optical transceivers, progressing toward 800G, 1.6T, and 3.2T.

LOS ANGELES, Calif., March 12, 2026 – Eoptolink Technology Inc., Ltd., a global leader and innovator in advanced optical interconnect solutions, today announced the launch of its industry-first 12.8T XPO product, a next-generation pluggable optical transceiver engineered to support a wide range of AI data center architectures, including scale-up, scale-out, and metro-reach fabrics.