Málaga, Spain – September 24, 2026 – The 52nd European Conference on Optical Communication and Exhibition (ECOC 2026) has officially concluded. This exhibition focused on exploring cutting-edge technologies that underpin next-generation AI infrastructure, optical networks, and high-performance connectivity. Eoptolink Technology Inc., Ltd. (“Eoptolink”) exhibited a range of high-speed optical interconnect solutions including eXtra-dense Pluggable Optics (XPO) and Near-Packaged Optics (NPO), attracting many visitors to stop by for discussions.

As one of Europe’s premier optical communications industry events, ECOC 2026 brought together more than 340 leading companies in optical communications and photonics from around the world and attracted over 8,300 industry professionals. The event explored optical communications technologies that support next-generation AI infrastructure, optical networks, and high-performance interconnect, covering scenarios such as AI data center optical solutions and carrier-grade optical network upgrades.

At the exhibition, Eoptolink showcased a portfolio of optical module solutions, including the 6.4T NPO, 12.8T XPO, 1.6T DR4 and 1.6T DR8/2FR4, with the 6.4T NPO drawing widespread interest from attendees. The 6.4T NPO is a high-density near-package optical transceiver module designed to address power, performance and density challenges in AI data center interconnects. Leveraging advanced silicon photonics (SiPh) technology, it features 32 channels operating at 200 Gbps each, delivering an aggregate throughput of 6.4 Tbps.

As global AI compute demand continues to surge, optical interconnect technology is accelerating toward higher density, lower power consumption and higher bandwidth. As a global leader and innovator in optical interconnect solutions, Eoptolink will continue to focus on the forefront of optical communications technology and work with industry partners worldwide to unlock new growth opportunities.