Eoptolink Unveils High-Density 6.4T NPO Solution at OFC 2026

Super User (denis.semenchenko@gmail.com)
2026-03-13T15:17:28+00:00
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Eoptolink (denis.semenchenko@gmail.com)

LOS ANGELES, Calif., March 13, 2026 – Eoptolink Technology Inc., Ltd., a global leader and innovator in advanced optical interconnect solutions, today announced the launch of its high-density 6.4T NPO optical module at OFC 2026. Designed to meet the demanding requirements of AI data centers, the new solution delivers exceptional performance, density, and efficiency for next-generation optical interconnects.

Eoptolink’s 6.4T NPO is a high-density near-packaged optical transceiver module designed to address performance and density challenges in AI data center interconnects. The module delivers 6.4 Tbps aggregate throughput across 32 lanes operating at 200 Gbps each, leveraging advanced Silicon Photonics (SiPh) technology.